UTB series electroless copper and tin plating are suitable for PCB and FPC manufacturing

UTB chemical pure tin process: tab COF. BGA et al.

Electroless tin deposition is a speed type plating solution, which is 2-3 times faster than general electroless tin deposition

The plating solution is not easy to be turbid and has a wide temperature range

It has been widely used in international well-known electronic semiconductor enterprises