UTB / Sula series lead-free products for wafer electroplating

Environmental protection, fully comply with ROHS specifications

Good height uniformity and minimal dimensional deviation

No voids

UTB / Sula series lead-free products for wafer (Bump) electroplating

Sula tin silver products can reduce radioactive substances (p-210) in SN Ag materials and reduce α Linear quantity

It has been mature and applied to international well-known enterprises

Bump lead-free plating solution is in a leading position in the world